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NEC ELECTRONICS INC.
MAY 1999 TRQ-99-05-323 QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT
This report contains reliability data on microprocessor and microcomputer devices fabricated at NEC Roseville and assembled at NEC Roseville or NEC Singapore. (Signatures on file) Prepared by D. Yee RQC Dept. Roseville Mfg.
Approved by M. Mahal RQC Dept. Roseville Mfg.
Please refer all inquiries to: NEC Electronics Inc. Attn: Reliability and Quality Assurance Department 7501 Foothills Boulevard Roseville, CA 95747 Tel. (916) 786-3900
The information in this document is subject to change without notice. No part of this document May be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which May appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied, or otherwise, is granted under any patents, copyrights, or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making a continuous effort to enhance the reliability, of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, firecontainment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard," "Special," and "Specific." The Specific quality grade applies only to devices developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment, and industrial robots. Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment, and medical equipment (not specifically designed for life support). Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, and life-support systems or medical equipment for life support, etc. The quality grade of NEC devices is Standard unless otherwise specified in NEC's data sheets or data books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
NEC Electronics Inc. is dedicated to the QCD principle of providing the highest Quality product at the lowest possible Cost with on-time Delivery to our customers.
NEC Electronics Inc.
Roseville Manufacturing
Table of Contents
Page
Failure Rate Prediction..................................................................................................... 3 Table 1. Reliability Tests ................................................................................................. 4 Table 2. Reliability Test Results ...................................................................................... 5 Table 3. HTB Life Test Summary and Failure Rate Predictions ..................................... 6 Table 4. Other Life Test Summaries (HTSL, HHSL, T/H) ............................................. 8 Table 5. Environmental and Mechanical Test Summaries (TS, T/C, PCT) .................... 9 Table 6. Failure Summaries ............................................................................................. 10 Table 7. CMOS-4 Process Family, Quarterly Reliability Data (Jan-Mar 99) ................. 11 Table 8. CMOS-5 Process Family, Quarterly Reliability Data (Jan-Mar 99) ................. 11
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NEC Electronics Inc.
Roseville Manufacturing
Failure Rate Prediction
This report contains reliability test results of all microprocessor devices assembled in NEC Roseville that were subjected to routine Monitor Reliability Testing (MRT). It also contains failure rate predictions for these devices, calculated using the Arrhenius method shown below. This report will be updated in September 1998. When predicting the failure rate at a certain temperature from accelerated life test data, various values of activation energy, corresponding to failure mechanisms, should be considered. This procedure is done whenever exact causes of failures are known by performing failure analysis. In some cases, however, an average activation energy is assumed in order to accomplish a quick first-order approximation. NEC assumes an average activation energy of 0.7 eV for CMOS-4 and lesser technologies and 0.45 eV for CMOS-5 and greater technologies for such approximations. These average values have been assessed from extensive reliability test results and yield a conservative failure rate. Since life testing at NEC is performed under high-temperature ambient conditions, the Arrhenius relationship is used to normalize failure rate predictions at a system operation temperature of 55C. The Arrhenius model includes the effects of temperature and activation energy of the failure mechanisms. This model assumes that the degradation of a performance parameter is linear with time. The temperature dependence is taken to be an exponential function that defines the probability of occurrence. The Arrhenius equation is: -E (T -T ) A= exp A J1 J2 k(T )(T ) J1 J2 Where: A Acceleration factor EA T J1 T J2 k Activation energy Junction temperature (in K) Junction temperature (in K) at TA1 = 55C at TA2 = 125C = = (1) L= X2 105 2T (2)
Where: L X2
Failure rate in %/1000 hours The tabular value of chi-squared distribution at a given confidence level and calculated degrees of freedom (2f + 2, where f = number of failures) T Number of equivalent device hours = (Number of devices) x (number of test hours) x (acceleration factor)
T
Another method of expressing failures is as FIT (failures in time). One FIT is equal to one failure in 109 hours. Since L is already expressed as %/1000 hours (10-5 failure/hr), an easy conversion from %/1000 hours to FIT would be to multiply the value of L by 104. Example A sample of 960 pieces was subjected to 1000 hours at 125C burn-in. One reject was observed. Given that the acceleration factor was calculated to be 34.6 using equation (1), what is the failure rate, normalized to 55C, using a confidence level of 60%? Express the failure rate in FIT. Solution For n = 2f + 2 = 2(1) + 2 = 4, X2 = 4.046. Then L = X2 105 2T (%/1000H)
X2 105 2 (s.s.)(test hrs)(acc. factor) (4.046) 105 2(960)(1000)(34.6) 0.0061 %/1000H Therefore, FIT = (0.0061)(104) = 61
Boltzmann's constant = 8.62 x 10-5 eV/K
Because temperature dependence on power dissipation of a particular device type cannot be ignored, junction temperatures (TJ1 and TJ2) are used instead of ambient temperatures (TA1 and TA2) . Also, thermal resistance of a particular device cannot be ignored. These two factors cannot be accounted for unless junction temperatures are used. We calculate junction temperatures using the following formula: TJ = TA + (Thermal Resistance) x (Power Dissipation at TA) From the high-temperature operating life test results, the failure rates can be predicted at a 60% confidence level using the following equation:
=
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NEC Electronics Inc.
Table 1. Reliability Tests
Roseville Manufacturing
The major reliability tests performed by NEC consist of high-temperature bias (HTB), 85C/85% relative humidity (T/H), high-temperature storage life (HTSL), and high-humidity storage life (HHSL) tests. Additionally, various environmental and mechanical tests are performed. This table shows the conditions of the various life tests, environmental tests, and mechanical tests.
Test Item High-temperature bias life High-temperature storage life Temperature and humidity life Symbol HTB HTSL T/H MIL-STD 883C Method 1005 1008 Condition TA = 125C, VCC = 5.5 V. TA = 150C. TA = 85C, RH = 85%. VDD = 5.5 V, alternate pin bias. TA = 85C, RH = 85%. TA = 125C, RH = 100% P = 2.3 atm. -65 to 150C, 1 hour/ cycle. 125g (DIP) 250g (QFP), three bends, 90, without breaking. TA = 230C, 5 sec, rosinbased flux. 260C, 10 sec, rosin based flux. 215C VPS 235C, IR reflow 10 cycles, -65 to 150C. 15 cycles, 0 to 100C. Remarks Note 1 Note 1 Notes 1, 2
High-humidity storage life Pressure cooker
HHSL PCT
Notes 1, 2 Notes 1, 2
Temperature cycle Lead fatigue
T/C LI
1010 2004
Note 1 Note 4
Solderability Soldering heat
SD TS
2003 Note 3
Note 5 DIP PLCC QFP Note 1
Temperature cycle Thermal shock Notes:
1010 1011
1. Electrical test per data sheet is performed. Devices that exceed the data sheet limits are considered rejects. 2. Pretreatment as specified. 3. MIL-STD 750A, method 2031. 4. Broken lead is considered a reject. 5. Less than 95% coverage is considered a reject.
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NEC Electronics Inc.
Table 2. Reliability Test Results
Roseville Manufacturing
The reliability test results given in this report are representative of the following products fabricated in Roseville and assembled in Roseville or Singapore. Fabricated in Roseville D7720A NMOS-4 D78H11 CMOS-4 CX2 D17003AH D6701 D70108 D77C20A D77C25 D7502A D7503A D75004 D75108A D75304 D75306 D75308 D75312 D75316 D75328 D17010 D70208 D70216 D70322 D70325 D70335 D78C10 D78C11A D78C14 D78213 D78234 D78238 D78322 D937LH Assembled in Roseville 28-pin DIP
D7720AC D77C20AC D77C25C D70108C D70116C D70208L D70216L D70320L D70325L D70335L D7502AGF D7503AGF D75304GF D75306GF D75308GF D75312GF D75316GF
40-pin DIP
68-pin PLCC
84-pin PLC
64-pin QFP
80-pin QFP
CMOS-5 CX3:
Assembled in Singapore 80-pin QFP 75216AGF 75308GF 78C10AGF 78352BG
64-pin LQFP
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NEC Electronics Inc.
Table 3. HTB Life Test Summary and Failure Rate Predictions
Roseville Manufacturing
This table summarizes the reliability test results of processes extensively used by most NEC microprocessor products. The failure rate predictions are based on both 125C and 150C high-temperature bias life test results. Failure rate predictions are shown for the current period of available data and for past periods of cumulative data.
PD7720AC (28-pin DIP) Process Type Jan 88-Dec 98 (cumulative) Process Period (125C) Ambient Temp. (125C) (125C) (125C) (125C) (125C) (125C) (125C) (125C) (125C) (125C) (125C) (125C) 448 Number of Devices 448 432 96 24 168 384 120 360 312 552 72 24 520,000 Accum,. Device Hours 520,000 432,000 96,000 24,000 168,000 384,000 120,000 360,000 311,168 552,000 72,000 24,000 0 No. of Failures 0 0 0 0 0 0 0 0 1 0 0 0 17.9 Accel. Factor (Note 1) 17.9 32.6 32.6 32.6 32.6 32.6 32.6 32.6 32.6 32.6 32.6 32.6 9.3 x 106 Equiv. Device Hours 9.3 x 106 1.41 x 107 3.13 x 106 7.82 x 105 5.48 x 106 1.25 x 107 2.35 x 106 8.61 x 106 9.39 x 106 1.80 x 107 2.35 x 106 7.82 x 105 Failure Rate, 55C and 60% Confidence Level (Note 2) 0.0098 %/1000 = 98.0 FIT
NMOS-4 Jan 88- Mar 99 Total (cumulative) PD77C20AC Jul 90- Mar 99 (28-pin DIP) (cumulative) PD77C25C Jul 90- Mar 99 (28-pin DIP) (cumulative) PD70108C Jan 90- Mar 99 (40-pin DIP) (cumulative) PD7503A Jan 97- Mar 99 (64-pin QFP) (cumulative) PD75304 Apr 92- Mar 99 (80-pin QFP) (cumulative) PD75306 Apr 92- Mar 99 (80-pin QFP) (cumulative) PD75308 Jan 90- Mar 99 (80-pin QFP) (cumulative) PD75312 Jul 94- Mar 99 (80-pin QFP) (cumulative) PD75316 Jul 94- Mar 99 (80-pin QFP) (cumulative) PD17010 Oct 94- Mar 99 (80-pin QFP) (cumulative) PD78C10 Jan 92- Mar 99 (80-pin QFP) (cumulative) Singapore Assembly PD75216 Jan 92- Mar 99 (80-pin QFP) (cumulative) Singapore Assembly PD75308 Jan 92- Mar 99 (80-pin QFP) (cumulative) Singapore Assembly CMOS-4 Jan 89- Mar 99 Total (cumulative) PD70208 Jan 92- Mar 99 (68-pin PLCC) (cumulative) PD70216 Apr 93- Mar 99 (68-pin PLCC) (cumulative) PD70320 Jul 91- Mar 99 (84-pin PLCC) (cumulative) PD70325 Jan 92- Mar 99 (84-pin PLCC) (cumulative)
(125C)
144
144,000
0
32.6
4.69 x 106
(125C)
120
120,000
0
32.6
3.91 x 106
(125C) (125C) (125C) (125C) (125C)
2808 748 936 508 644
2,812,168 736,000 936,000 508,000 644,000
1 0 0 0 1
32.6 11.3 11.3 11.3 11.3
9.17 x107 805. x 106 1.06 x 107 3.30 x 106 5.65 x 106
0.0022%/1000 = 22FIT
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NEC Electronics Inc.
Roseville Manufacturing
Table 3. HTB Life Test Summary and Failure Rate Predictions (continued)
Process Type Process Period Ambient Temp. (125C) (125C) (125C) (125C) Number of Devices 532 3368 192 192 Accum,. Device Hours 532,000 3,356,000 192,000 192,000 No. of Failures 0 1 0 0 Accel. Factor (Note 1) 11.3 11.3 _ _ Equiv. Device Hours 6.01 x 106 3.79 x 107 _ _ Note 3 0.0053%/1000H = 53FIT Failure Rate, 55C and 60% Confidence Level (Note 2)
PD70335 (84-pin PLCC) CMOS-5 Total PD78352 (64-pin LQFP) CMOS-8 Total Notes:
Jan 94- Mar 99 (cumulative) Apr 88- Mar 99 (cumulative) Oct 94- Mar 99 (cumulative) Oct 94- Mar 99 (cumulative)
1. The acceleration factor was calculated using the Arrhenius mathematical model. 2. FIT was derived from HTB data for all available time periods. 3. Some of the above FIT rates were not calculated. Due to small sample sizes in these cases, the FIT rates would not be meaningful. NEC expects a FIT rate of less than 100 for micro device types (target not to exceed 150).
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NEC Electronics Inc.
Table 4. Other Life Test Summaries (HTSL, HHSL, T/H)
Roseville Manufacturing
This table summarizes the reliability test results of the different process types during 150C/175C/200C storage and 85C/85% RH storage and bias tests. The data is summarized for the current period of available data and for past periods of cumulative data.
Process Type PD7720AC (28-pin DIP) NMOS-4 Total PD77C20AC (28-pin DIP) PD77C25C (28-pin DIP) PD70108C (40-pin DIP) PD70116C (40-pin QFP) PD7503A (64-pin QFP) PD75304 (80-pin QFP) PD75306 (80-pin QFP) PD75308 (80-pin QFP) PD75312 (80-pin QFP) PD75316 (80-pin QFP) PD17010 (80-pin QFP) PD78C10 (80-pin QFP) PD75216 (80-pin QFP) PD75308 (80-pin QFP) CMOS-4 Total PD70208 (68-pin PLCC) PD70216 (68-pin PLCC) PD70320 (84-pin PLCC) PD70325 (84-pin PLCC) PD70335 (84-pin PLCC) CMOS-5 Total PD78352 (64-pin LQFP) Process Period Jan 88- Mar 99 (cumulative) Jan 88- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) HTSL Failures Hours 168 500 1000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 0 0 0 0 0 0 HHSL Failures Hours 168 500 1000 T/H Failures Hours 168 500 1000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 2 0 0 1 0 0 0 0 0 4 0 0 0 0 0 0 0
Qty 380 380 360 80 20 100 180 324 80 300 260 500 40 0 0 0 2244 604 804 476 584 516 2984 0
Qty 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0
Qty 448 448 432 96 24 120 216 380 96 384 312 520 72 204 260 220 3336 620 912 528 692 528 3280 192
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NEC Electronics Inc.
CMOS-8 Total Jan 90- Mar 99 (cumulative) 0 0 -
Roseville Manufacturing
192 0 0 0
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NEC Electronics Inc.
Roseville Manufacturing
Table 5. Environmental and Mechanical Test Summaries (TS, T/C, PCT)
Process Type PD7720AC (28-pin DIP) NMOS-4 Total PD77C20AC (28-pin DIP) PD77C25C (28-pin DIP) PD70108C (40-pin DIP) PD70116C (40-pin DIP) PD7503A (64-pin QFP) PD75304 (80-pin QFP) PD75306 (80-pin QFP) PD75308 (80-pin QFP) PD75312 (80-pin QFP) PD75316 (80-pin QFP) PD17010 (80-pin QFP) PD78C10 (80-pin QFP) PD75216 (80-pin QFP) PD75308 (80-pin QFP) CMOS-4 Total PD70208 (68-pin PLCC) PD70216 (68-pin PLCC) PD70320 (84-pin PLCC) PD70325 (84-pin PLCC) PD70335 (84-pin PLCC) CMOS-5 Total PD78352 (64-pin LQFP) CMOS-8 Total Process Period Jan 88- Mar 99 (cumulative) Jan 88- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jul 88- Mar 99 (cumulative) Jul 90- Mar 99 (cumulative) Jan 90- Mar 99 (cumulative) Qty 261 261 342 72 18 54 90 234 54 224 162 332 54 0 0 0 1636 324 468 180 144 306 1422 0 0 TS Failures 0 0 0 0 0 0 0 0 2 0 0 0 0 2 1 0 1 0 0 2 0 0 Qty 380 460 450 100 24 125 225 400 125 350 300 500 75 0 0 0 2674 800 975 525 675 600 3575 60 60 T/C Failures 100 Cycles 300 Cycles 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 1 2 1 0 3 1 1 6 0 0 Qty 380 380 360 100 20 100 180 320 100 300 240 400 60 180 120 100 2580 600 820 419 580 460 2879 180 180 PCT Failures 96 Hours 102 Hours 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0
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NEC Electronics Inc.
Table 6. Failure Summaries
CMOS-4
Test Item T/C T/C PCT HTB T/H T/H T/H HTSL HHBT TS T/H HTSL Duration 300 cyc. 300 cyc. 192 hrs. 168 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 168 hrs. 1000 hrs Period Jul 94-Oct 94 Jan 95-Mar 95 Jan 92-Apr 92 Oct 95-Dec 95 Jan 96-Mar 96 Oct 95-Dec 95 Jan 92-Apr 92 Apr 96-Jun 96 Oct-Dec 96 Jul-Sep 97 Apr-Jun 98 Sep-Dec 98
Roseville Manufacturing
Failure 1 PC DC Failure 1 PC DC Failure 1 PC DC Failure 1 PC FUN Failure 1 PC DC Failure 1 PC FUN Failure 1 PC FUN Failure 1 PC DC Failure 1 PC FUN Failure 2PC DC Failure 1 PC DC Failure 1 PC DC Failure
CMOS-5
Test Item HTB T/C T/C T/S HTB T/C T/C T/C Duration 1000 hrs. 300 cyc. 300 cyc. 15 cyc. 168 hrs. 300 cyc. 300 cyc. 300 cyc. Period Jul 92-Sep 92 Apr 92-Jun 92 Jul 95-Sep 95 Apr 96-Jun 96 Jan 97-Jun 97 Apr 97-Jun 97 Apr 97-Jun 97 Jul-Sep 97 Failure 1 PC DC Failure 1 PC DC Failure 1 PC FUN Failure 1 PC FUN Failure 1 PC DC Failure 1 PC DC Failure 1 PC DC Failure 1PC DC Failure
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NEC Electronics Inc.
Roseville Manufacturing
Table 7. CMOS-4 Process Family, Quarterly Reliability Data (Jan-Mar 99)
Life Tests
HTB Failures Hours 168 500 1000 0 0 0 T/H Failures Hours 168 500 1000 0 0 0 HTSL Failures/ Hours 168 500 1000 0 0 1
Device Type PD7503A (80-pin QFP)
Assembly Month Jan- Mar 99
Qty 24
Qty 24
Qty 20
Environmental Tests
T/C Failures Cycles 100 300 0 0 PCT Failures Hours 192 288 0 0
Device Type PD75312 (80-pin QFP)
Assembly Month Jan-Mar 99
Qty 25
Qty 20
96 0
Qty 18
TS Failures -
Table 8. CMOS-5 Process Family, Quarterly Reliability Data (Jan-Mar 99)
Life Tests
Assembly Month Jan- Mar 99 Jan- Mar 99 HTB Failures Hours 168 500 1000 0 0 0 0 0 0 T/H Failures Hours 168 500 1000 0 0 0 0 0 0 HTSL Failures Hours 168 500 1000 0 0 0 0 0 0
Device Type PD70216 (68-pin PLCC) PD70335 (84-pin PLCC)
Qty 24 24
Qty 24 24
Qty 20 20
Environmental Tests
T/C Failures Cycles 100 300 0 0 0 0 PCT Failures Hours 192 288 0 0 0 0
Device Type PD70216 (68-pin PLCC) PD70335 (84-pin PLCC)
Assembly Month Jan- Mar 99 Jan- Mar 99
Qty 25 25
Qty 20 20
96 0 0
Qty 18 18
TS Failures 0 0
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